Packaging

Junction Temperature Rise

First-order steady-state temperature rise through a declared thermal resistance.

Reference source ↗

Packaging / FORMULA V1ΔT(°C) = Power(W) × θJA(°C/W)

Dissipated power (W)Thermal resistance (°C/W)

RESULT37.500000°C

First-order steady-state temperature rise through a declared thermal resistance.

Boundary: θJA depends on board, airflow and test conditions; not suitable for detailed thermal signoff. Validate units, corners and tool-specific definitions before design decisions.

Reference: National Institute of Standards and Technology · retrieved 2026-08-26