Packaging

Chiplet Composite Yield

Independent-yield product for an illustrative multi-die assembly.

Packaging / FORMULA V1Composite Yield = ∏ die yields

Die 1 Yield (%)Die 2 Yield (%)Assembly Yield (%)

RESULT81.144000%

Independent-yield product for an illustrative multi-die assembly.

Boundary: Assumes independent events and omits known-good-die test coverage and correlated failures. Validate units, corners and tool-specific definitions before design decisions.